 |
MS1000 / MS2000
(À̵¿½Ä
±¹¼Ò¹è±â
Á¤ÈÀåÄ¡)
ÇÊÅÍ & dry
|
1. ¹ÐÆóµÈ °ø°£ ³» ¾ÇÃë(CL2,BCL3,NH3) ¹× VOCÁ¦°Å
- Chemical ±³Ã¼ÀÛ¾÷ ¹× ´©Ãâ½Ã ±¹¼ÒºÎÀ§ ³¿»õÁ¦°Å
- Toxic Gas ´©ÃâµîÀÇ Emergency »óȲ½Ã ´Ü±â°£ ºñ»ó ¡¡Scrubber·Î »ç¿ë°¡´É
- ¿À¿°¹ß»ý À§Ä¡ ¹× ¿À¿°¿ø¿¡ µû¶ó Æ÷ÁýÁ¦ ¼±Åð¡´É
ex : CL2 , BCL3, HF , HCL , F2 , NH3, H2S, CH3SH, NaOH , ¡¡CCl4 ¡¦.,
2. Clean Air Recycling ¹æ½Ä
- ¿À¿°µÈ °ø±âÀÇ ¿À¿°¹°Áú¸¸ Á¦°ÅÇϰí, Clean Air´Â ULPA Filter¡¡¸¦ ÅëÇÏ¿© Cleanroom³»·Î ¹èÃâÇÔ.
- ¿À¿°µÈ °ø±â¸¦ ¿ÜºÎ·Î ¹è±âÇÏÁö ¾ÊÀ¸¹Ç·Î Cleanroom Air Balance¸¦ À¯ÁöÇÔ.
- Filter¸¦ ä¿ëÇÏ¿© Cleanroom ¸ðµç °ø°£¿¡¼ »ç¿ë°¡´ÉÇϸç,
ƯÈ÷ °øÁ¤Àåºñ¿¡ Á÷Á¢»ç¿ë °¡´ÉÇÔ.
3. À̵¿ ¹× °íÁ¤½ÄÀ¸·Îµµ ¼³Ä¡°¡´É
- CompactÇÑ DesignÀ¸·Î Cleanroom Àü¿ª¿¡ »ç¿ë°¡´É
- Á¦ÇÑµÈ °ø°£¿¡´Â °íÁ¤½ÄÀ¸·Î ¼³Ä¡°¡´É
4. Operator
- Photo Resist(ÀÌÇÏ PR) ±³Ã¼ÀÛ¾÷½Ã ¹ß»ýµÇ´Â VOC Á¦°Å
- Bowl Change µîÀÇ ÀåºñPM½Ã ¹ß»ýµÇ´Â ³¿»õÁ¦°Å
- Àåºñ Trouble·Î ÀÎÇÑ Chemical ´©Ãâ½Ã ¹ß»ýµÇ´Â ³¿»õÁ¦°Å
(mocvd, Photo, Wet Etch, CVDµî )
5. Engineer
- PR, EBR, Developer, HMDS Filter ±³Ã¼½Ã ¹ß»ýµÇ´Â ¾ÇÃëÁ¦°Å
- Wet Etching¿ë Chemical Filter±³Ã¼½Ã ¹ß»ýµÇ´Â Èֹ߼º¿À¿°¹° (VOC) È®»ê¹æÁö
- Chamber ÀåºñÀÇ Gas Line±³Ã¼ ¹× Modification½Ã ¹ß»ý,¿¹ÃøµÇ´Â Gas´©Ãâ, È®»ê¹æÁö
- Chamber Cleaning½Ã ¹ß»ýµÇ´Â Particle È®»ê¹æÁö
6. ±âŸ
- ¹ÐÆóµÈ °ø°£ ¶Ç´Â ¹è±â°¡ Á¦ÇѵǴ °ø°£ÀÇ ¾ÇÃëÁ¦°Å
(¿¹. CMP, Parts Cleaning roomµî ¹ÝµµÃ¼ Àü °øÁ¤Àû¿ë) |
MS1000
4,000slm
MS2000
20,000slm |
Power
208~220V |